Applied Materials and SK hynix Forge Innovative R&D Alliance to Propel AI Memory Technologies

On March 10, 2026, Applied Materials, Inc. announced a groundbreaking long-term partnership with SK hynix Inc., aimed at revolutionizing the development and deployment of next-generation Dynamic Random-Access Memory (DRAM) and high-bandwidth memory (HBM) technologies. This collaboration is set to unfold at Applied’s advanced EPIC Center in Silicon Valley, where engineers from both companies will work closely to address the challenges posed by the rapidly evolving landscape of artificial intelligence (AI) and high-performance computing.

Gary Dickerson, President and CEO of Applied Materials, expressed enthusiasm about this partnership, noting the shared history between the two companies in enhancing the energy efficiency of advanced memory chips. "We are excited to have SK hynix join the EPIC Center as a founding partner, and we look forward to driving further breakthroughs together that accelerate commercialization of next-generation DRAM and HBM technologies for the AI era," he stated.

Nohjung Kwak, President and CEO of SK hynix, highlighted the critical demand for energy-efficient memory technologies driven by the scaling of AI systems. He pointed out a significant challenge in the sector: the increasing gap between memory speeds and processor advancements. "Our advanced memory technologies are paving the way for faster and more energy-efficient data processing," Kwak emphasized, as he looked forward to delivering innovative memory solutions optimized for AI through this partnership.

The two companies have formalized their collaboration through a comprehensive technology development agreement. This initiative will tackle long-term semiconductor R&D challenges for next-generation memory by launching co-innovation programs that concentrate on new materials, complex integration schemes, and advanced packaging strategies for HBM-class devices. The primary aim is to enhance the performance and manufacturability of future memory architectures.

The EPIC Center's high-velocity co-innovation model will facilitate this collaboration, allowing SK hynix engineers to work alongside Applied technologists, thereby accelerating the development of new technologies. Additionally, SK hynix will utilize Applied’s advanced packaging R&D capabilities in Singapore, effectively linking device-level innovation with heterogeneous integration to confront the challenges of 3D advanced packaging.

Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, articulated the significance of materials engineering innovations across device and packaging levels. "By combining the power of the EPIC Center in Silicon Valley with Applied’s advanced packaging capabilities in Singapore, our collaboration with SK hynix will enable us to co-optimize the entire technology stack and accelerate the path to manufacturable memory innovations," he stated.

Seon Yong Cha, Chief Technology Officer of SK hynix, underscored the necessity for new approaches in developing wafer fabrication equipment to advance memory technology for the AI era. He noted that the co-innovation programs aim to address new materials, integration strategies, and thermal management technologies, which are essential for device engineering and advanced packaging.

As part of this partnership, SK hynix becomes a founding partner of the EPIC Center, which is set to become operational later this year. This center represents a monumental investment of $5 billion by Applied Materials in advanced semiconductor equipment R&D, marking the largest U.S. investment of its kind. Designed to expedite the commercialization of breakthrough technologies, the EPIC Center aims to reduce the timeline from early-stage research to full-scale manufacturing significantly.

Chipmakers engaging with the EPIC Center will gain earlier access to Applied’s R&D portfolio, benefiting from faster learning cycles and a more efficient transfer of next-generation technologies into high-volume production. Furthermore, the collaborative programs at the EPIC Center will enhance Applied’s ability to direct R&D investments with greater visibility across multiple technology nodes, thereby increasing overall productivity and value generation.

As customer projects commence, capital spending is projected to scale to approximately $5 billion, reflecting the anticipated growth trajectory of this collaboration. This partnership not only strengthens the technological capabilities of both companies but also positions them at the forefront of memory innovations crucial for the AI revolution.

In summary, the collaboration between Applied Materials and SK hynix signifies a pivotal step in addressing the semiconductor industry's challenges while paving the way for innovative memory solutions that meet the demands of the AI era. The EPIC Center is poised to become a catalyst for future advancements, ultimately shaping the landscape of high-performance computing and AI applications.