Applied Materials Partners with SCREEN to Advance Wafer Cleaning Technologies

In a significant move for the semiconductor industry, Applied Materials, Inc. (Nasdaq: AMAT) has announced a partnership with SCREEN Semiconductor Solutions Co., Ltd. (SCREEN SPE) to enhance wafer cleaning technologies at the newly established EPIC Center in Silicon Valley. This collaboration aims to integrate SCREEN SPE’s expertise in wafer cleaning with Applied's advanced materials engineering capabilities, thereby accelerating the development of co-optimized process solutions for cutting-edge semiconductor chips.

As semiconductor devices grow in complexity, maintaining precise wafer surface cleanliness becomes increasingly vital. Cleanliness is not just a quality assurance measure; it is a critical enabler of yield, device performance, and reliability at advanced process nodes. With defects arising during deposition, etch, and materials modification, the need for meticulous cleaning solutions has never been more pronounced. The partnership between Applied Materials and SCREEN SPE seeks to address these challenges head-on.

By combining their respective strengths—Applied's deep expertise in deposition, dry etch, and materials modification with SCREEN SPE’s industry-leading cleaning, wet etch, and surface preparation technologies—the two companies aim to create end-to-end process solutions. These innovations will support chipmakers in achieving higher yields and a quicker time-to-production for next-generation devices.

Dr. Prabu Raja, President of the Semiconductor Products Group at Applied Materials, expressed enthusiasm about the collaboration. "The EPIC Center is designed to dramatically accelerate the commercialization of next-generation semiconductor technologies by co-locating and co-innovating with customers and partners across the entire semiconductor ecosystem," he stated.

This new collaboration is a natural progression of a long-standing relationship between the two companies. Previously, joint development efforts took place at Applied's Materials Engineering Technology Accelerator (META) Center in Albany, New York, where SCREEN SPE's single-wafer cleaning systems have already supported pre- and post-process cleaning optimization.

The EPIC Center will expand the scope and scale of this partnership, enabling engineering teams from both companies to work closely on a wider array of next-generation process challenges. This proximity is expected to foster faster cycles of learning and more direct integration into Applied's research and development programs.

Applied's new EPIC (Equipment and Process Innovation and Commercialization) Center is positioned to become the largest U.S. investment in advanced semiconductor equipment research and development. Spanning over 180,000 square feet on Applied's Silicon Valley campus, the center is meticulously designed to expedite the journey from early-stage research to full-scale manufacturing, potentially compressing timelines by as much as 50%.

The EPIC Center will serve as a collaborative hub for chipmakers, equipment suppliers, and research institutions, allowing them to work alongside Applied's teams. This environment is expected to significantly enhance the development of next-generation semiconductor technologies, with the facility set to become operational in 2026.

The partnership between Applied Materials and SCREEN SPE signifies a forward-looking approach to tackling the increasingly complex challenges in semiconductor manufacturing. By combining their innovative capabilities, both companies aim to push the boundaries of technology, ultimately leading to higher performance and greater reliability in the devices that power the modern world.

As the semiconductor landscape continues to evolve, this collaboration marks a strategic step toward meeting the industry's growing demands and setting new standards in wafer cleaning technology.