Keysight Technologies Unveils Revolutionary 3D Interconnect Designer

In a move set to transform the landscape of advanced chip design, Keysight Technologies, Inc. (NYSE: KEYS) has announced the launch of its latest innovation, the 3D Interconnect Designer. This groundbreaking addition to Keysight's Electronic Design Automation (EDA) portfolio focuses on the intricate design of 3D interconnects for chiplet architectures and 3D Integrated Circuits (3DICs), specifically targeting applications within AI infrastructure and data centers.

As the semiconductor industry increasingly gravitates toward chiplet architectures, engineers are faced with unprecedented challenges in creating effective 3D interconnect designs. These designs involve a myriad of components, including vias, transmission lines, solder balls, and micro-bumps, all while ensuring signal and power integrity in densely packed configurations. Traditional design workflows often fall short, leading to extended product development cycles and a significant drain on resources due to repetitive design iterations.

The introduction of the 3D Interconnect Designer aims to alleviate these issues by streamlining the design process and enabling engineers to focus on innovation rather than getting bogged down in manual optimization tasks.

One of the standout features of the 3D Interconnect Designer is its ability to accelerate design cycles. By automating time-consuming manual steps, the solution minimizes human error and increases the likelihood of first-pass success. This efficiency not only reduces time-to-market but also alleviates the bottleneck that has plagued many engineering teams.

The new tool also addresses compliance concerns. It validates designs against emerging standards such as UCIe and Bandwidth on Wire (BoW), including Voltage Transfer Function (VTF) verification, early in the design lifecycle. By identifying potential issues at an early stage, it mitigates the risk of costly redesigns due to late-stage failures.

With electromagnetic-based simulation capabilities, the 3D Interconnect Designer provides precise electrical analysis for printed circuit boards (PCBs) and package 3D interconnect designs. This feature allows engineers to predict performance accurately, ensuring that designs not only meet specifications but also perform reliably in real-world applications.

The 3D Interconnect Designer integrates effortlessly with Keysight's existing EDA tools and also offers a standalone version. This flexibility allows engineering teams to incorporate advanced 3D interconnect design and optimization into their established workflows seamlessly. Furthermore, when paired with the Chiplet PHY Designer, the solution enables precise design and optimization tailored specifically for chiplet and 3DIC applications, reducing costly design iterations.

Nilesh Kamdar, the EDA Design and Verification General Manager at Keysight, commented on the new tool's significance: “With today's complexity, manual 3D interconnect design and optimization have become a significant bottleneck. By streamlining the process and providing early insights into potential issues like signal and power integrity, we're enabling engineers to get products to market faster and deliver compliant designs on tighter timelines.”

For those interested in seeing the 3D Interconnect Designer in action, it will be showcased at the upcoming DesignCon conference at the Keysight booth #1039. This demonstration will provide an opportunity for attendees to witness firsthand how the tool can revolutionize the design of 3D interconnects.

The launch of the 3D Interconnect Designer by Keysight Technologies marks a pivotal moment in the evolution of chip design, especially as industries increasingly rely on sophisticated AI infrastructure and data center applications. By addressing the complexities of modern chiplet architectures with innovative solutions, Keysight continues to empower engineers to accelerate innovation and enhance product development processes in a rapidly changing technological landscape.