On July 8, 2026, Arteris, Inc. (Nasdaq: AIP), a prominent player in semiconductor technology, unveiled a significant collaboration with IC-Link by imec, a design and manufacturing service provider specializing in ASICs and silicon photonics. The partnership aims to integrate Arteris' advanced Network-on-Chip (NoC) intellectual property (IP) into the development of next-generation AI and high-performance computing (HPC) chiplets and application-specific integrated circuits (ASICs).

This collaboration is expected to streamline and enhance the complex design processes involved in semiconductor development, addressing the growing demands of AI and HPC systems.

2. Enhancing Semiconductor Development

As AI and HPC systems evolve, engineering teams face considerable challenges related to scale and complexity. The integration of Arteris' NoC IP technology with IC-Link's subsystem expertise will facilitate the creation of reusable, scalable architectures. This synergy is designed to reduce infrastructure development efforts, enhance design reuse, and accelerate the delivery timelines for intricate custom semiconductor platforms.

K. Charles Janac, President and CEO of Arteris, emphasized the importance of this collaboration, stating, "As semiconductor complexity continues to grow, including in AI ASICs, engineering teams increasingly need ways to reuse proven infrastructure and focus their efforts on high-performance differentiation." He highlighted that the partnership signifies a broader industry trend toward the adoption of reusable architectures, which are pivotal for boosting productivity and minimizing risks in AI and HPC semiconductor development.

3. Addressing Design Challenges

Ozgur Gursoy, Director of Portfolio and Strategy for ASICs at IC-Link, pointed out that IC-Link’s high-speed I/O subsystem reference design represents a transformative advance for ASIC developers targeting high-performance computing and artificial intelligence applications. He noted the traditional challenges faced by design teams during each new technology node, which often involve expensive and labor-intensive rework of I/O subsystems. The integration of Arteris’ leading NoC IP within this reference design aims to mitigate these risks, allowing HPC and AI teams to concentrate on optimizing their accelerator cores.

4. Meeting Future Demands

Modern AI and HPC systems, particularly AI ASICs, depend heavily on robust semiconductor data movement infrastructures that can adapt to increasing performance requirements while ensuring energy efficiency, safety, and security. Arteris technology is poised to assist engineering teams in crafting efficient silicon solutions for diverse applications, including AI data centers, edge AI devices, and physical AI systems.

As the demand for advanced semiconductor solutions continues to surge, the collaboration between Arteris and IC-Link by imec stands as a promising development in the semiconductor industry, potentially reshaping how next-generation AI and HPC devices are designed and manufactured.

For more information about Arteris and its cutting-edge semiconductor solutions, visit their official website at arteris.com/ai.

5. About Arteris

Arteris is recognized as a leading provider of semiconductor technology that accelerates the design of high-performance, power-efficient silicon with built-in safety, reliability, and security features. Their innovative products optimize data movement and reduce complexity in the modern AI landscape, utilizing NoC interconnect IP, SoC integration automation software, and hardware security assurance systems. Top technology companies around the globe use Arteris products to enhance performance, improve engineering productivity, minimize risks, and expedite the launch of advanced designs.

This partnership with IC-Link represents Arteris' commitment to driving innovation in semiconductor technology and meeting the challenges of tomorrow’s AI and HPC applications.

Original press release