ACM Research Unveils Ultra Lith BK: A Game-Changer in Lithography Solutions

In a significant advancement for the semiconductor manufacturing industry, ACM Research, Inc. (NASDAQ: ACMR) announced the delivery of its first Ultra Lith Baker (“Ultra Lith BK”) system on November 19, 2025. This cutting-edge tool is designed to tackle critical challenges in advanced lithography, making it a vital asset for semiconductor and display panel manufacturers. The announcement was made during SEMICON EUROPA, underscoring ACM's commitment to innovation in wafer and panel processing solutions.

The Ultra Lith BK system is engineered to address several key issues prevalent in modern lithography processes, such as process non-uniformity, thermal drift, and critical dimension (CD) variation. These challenges have become increasingly important as device geometries shrink, necessitating more precise manufacturing techniques to maintain yield stability and pattern fidelity.

Dr. David Wang, President and Chief Executive Officer of ACM, emphasized the importance of uniform process control in achieving consistent yield and device performance. He stated, “As lithography continues to push the limits of precision, maintaining uniform process control is essential for consistent yield and device performance.” The Ultra Lith BK's advanced features are designed to meet the elevated expectations of a new segment of customers—those in the display panel manufacturing industry.

The Ultra Lith BK boasts industry-leading ultraviolet (UV) curing uniformity, delivering ±5% UV intensity uniformity across the wafer. This ensures consistent resist hardening, a critical factor in maintaining the quality of semiconductor devices. The system supports various exposure modes, including line-scan, rotary, and hybrid UV-curing, providing flexibility to manufacturers as they adapt to different process requirements.

In addition to its UV capabilities, the Ultra Lith BK features a remarkable thermal management architecture. With temperature uniformity of ±0.1°C achieved through six cold plates, the system is designed to minimize CD variation, overlay errors, and pattern distortion. These enhancements are crucial for improving yield and ensuring long-term process reliability.

One of the standout attributes of the Ultra Lith BK is its configurable design. The system can accommodate up to 32 hotplates and two UV curing systems, allowing manufacturers to tailor the tool according to specific process recipes and photoresist integration needs.

Customers can choose between two types of hotplates:

The deployment of the Ultra Lith BK marks ACM's strategic entry into the display panel manufacturing sector, which is known for its high-volume mass production capabilities. This move is expected to enhance ACM's market presence and provide manufacturers with the high-performance tools required for current and future technology nodes.

Dr. Wang noted, “The delivery of the Ultra Lith BK marks a key milestone as the first customer deployment of our Track series following earlier demonstration and validation.” This milestone indicates ACM's commitment to not only meet but exceed the stringent demands of this burgeoning market.

ACM Research, Inc.'s announcement of the Ultra Lith BK system represents a pivotal moment in semiconductor manufacturing technology. With its innovative features designed to enhance process uniformity and flexibility, the Ultra Lith BK stands poised to address the industry's pressing challenges and cater to the evolving needs of display panel manufacturers. As the demand for precision in lithography continues to escalate, ACM's latest offering is set to play a crucial role in shaping the future of semiconductor and advanced packaging applications.

For more information about the Ultra Lith BK platform, interested parties can visit ACM at booth C1129 during SEMICON Europa, held from November 18-21 at Messe München.