ACM Research Qualifies High-Temperature SPM Tool for Chinese Customer
Innovative Technology Meets Growing Demand in Semiconductor Manufacturing
On March 3, 2025, ACM Research, Inc. (NASDAQ: ACMR), a prominent supplier of wafer processing solutions for the semiconductor industry, announced the qualification of its Single-Wafer High-Temperature Sulfuric Peroxide Mixture (SPM) tool by a major logic device manufacturer in mainland China. This significant milestone highlights ACM's commitment to addressing the evolving needs of the semiconductor market, particularly as technology nodes continue to advance.
1. Advancements in Wafer Processing Solutions
ACM Research has delivered its SPM tools to a total of thirteen customers, showcasing the growing trust and reliance on its innovative solutions. The qualified SPM tool features ACM's proprietary nozzle design, which minimizes acid mist splatter during the SPM process. This advancement is expected to improve particle performance, reduce the frequency of preventive maintenance cleaning, and enhance overall system uptime. The tool supports wet etching and wafer cleaning for both front- and back-end processes at technology nodes of 28 nanometers (nm) and below.
Industry Recognition and Commitment to Innovation
Dr. David Wang, ACM’s President and Chief Executive Officer, expressed enthusiasm for the tool's qualification, stating, “The Single-Wafer Moderate/High-Temperature SPM tool is a prime example of ACM’s commitment to innovation in solving customers’ challenges in high-volume 300mm semiconductor manufacturing. We’re already seeing great interest across our global customer base in this tool.” This statement underscores the increasing importance of high-temperature SPM tools in the manufacturing of next-generation semiconductor devices.
2. Versatility and Performance Features
The Single-Wafer Moderate/High-Temperature SPM tool is designed to accommodate a variety of wet etching and cleaning processes, including:
- Low-to-Medium Temperature Sulfuric Acid Cleaning: Operating at 90°C.
- High-Temperature Sulfuric Acid Photoresist Stripping: Operating at 170°C.
- Ultra-High Temperature Sulfuric Acid Metal Lift-Off: Operating at 190°C.
As semiconductor process nodes advance, the demand for single-wafer high-temperature sulfuric acid processing is surging. ACM's tool is equipped to handle these challenges, ensuring stringent requirements for particle control, chamber environment management, and sulfuric acid temperature stability are met. Key features of the tool include:
- Multi-Level Heating Method: Maintains a mixed temperature exceeding 230°C with steady control.
- SPM Nozzle Design: Prevents high-temperature SPM from splashing outside the chamber, achieving better particle control with an average count of fewer than 10 at 26nm.
Enhanced Cleaning Capabilities
The SPM tool is also equipped with an inline chemical mixing system, allowing for the accommodation of various chemical solutions. Additionally, it can integrate seamlessly with ACM's patented SAPS and TEBO megasonic technologies, which are designed to enhance organic contaminant removal and improve wafer surface preparation.
3. Comprehensive System Design
ACM’s Single-Wafer Moderate/High-Temperature SPM tool is tailored for both single- and double-sided cleaning processes, supporting wafer sizes from 150mm to 300mm. The system features four load ports, a configurable setup of 8 to 12 chambers, a multifunctional chemical distribution system, and a self-cleaning chamber, demonstrating ACM's commitment to high-performance, cost-effective solutions.
4. Conclusion
The qualification of ACM Research's Single-Wafer High-Temperature SPM tool marks a pivotal moment for the company and its customers in the semiconductor industry. As demand for advanced processing technologies continues to rise, ACM’s innovative solutions position the company as a key player in enhancing productivity and product yield for semiconductor manufacturers globally.
