Qnity Electronics, Inc. Recognized as ASE's Best Supplier for 2025

On May 28, 2026, Qnity Electronics, Inc. (NYSE: Q), a leading player in the semiconductor value chain, proudly announced its recognition as the recipient of the 2025 ASE Best Supplier Award from ASE Technology Holding Co., Ltd. This prestigious accolade highlights Qnity’s exceptional performance in delivering silicone-based materials, which are critical in the ever-evolving landscape of semiconductor manufacturing.

The ASE Best Supplier Award, conferred annually, is a hallmark of excellence among ASE's partners in the semiconductor industry. ASE Technology Holding Co., Ltd., one of the largest outsourced semiconductor assembly and test providers globally, bestows this honor on those who demonstrate outstanding capabilities in materials, equipment, and services. Qnity’s achievement underscores its commitment to providing high-quality materials that meet the rigorous demands of modern semiconductor applications.

As an industry frontrunner in advanced packaging materials, Qnity boasts a comprehensive portfolio that includes silicone-based lid seal and TIM1 materials. These innovations have proven essential for various packaging applications, including Flip Chip-Ball Grid Array (FCBGA) technologies. Qnity's materials facilitate high-volume manufacturing and are integral to the development of next-generation technologies, catering to the growing demands of AI and data center applications.

Qnity has established a long-standing and fruitful partnership with ASE, where its silicone-based materials have significantly contributed to ASE’s advanced packaging efforts. Through continuous collaboration with ASE’s site teams, Qnity has ensured smooth production processes and has effectively supported the ramp-up of new projects. This partnership spans the entire lifecycle of project development, from initial sampling and material evaluation to qualification and final adoption.

Chuck Xu, President of Interconnect Solutions at Qnity, remarked on the significance of this award, stating, “The move to 3D architectures and advanced packaging is raising the bar for performance, reliability, and manufacturability across the industry. ASE’s recognition highlights the role our materials play in enabling next-generation semiconductor packaging.” Xu's comments reflect the industry's shift toward more complex semiconductor architectures, which necessitate advanced materials that can withstand demanding operational environments.

As semiconductor devices become increasingly sophisticated, the need for high-performance materials like those offered by Qnity will only grow. The company’s silicone materials are designed to endure the stresses associated with advanced packaging technologies, reinforcing Qnity’s role in shaping the future of semiconductor manufacturing.

Qnity Electronics, Inc. stands as a premier technology solutions provider within the semiconductor value chain. The company is dedicated to empowering advancements in AI, high-performance computing, and advanced connectivity. By delivering groundbreaking solutions for semiconductor chip manufacturing and enabling high-speed transmission within complex electronic systems, Qnity is committed to making tomorrow’s technologies a reality.

For more information about Qnity Electronics, Inc. and its innovative solutions, visit their official website.

This recognition not only solidifies Qnity's reputation in the semiconductor industry but also positions it favorably for future growth and innovation as it continues to collaborate with industry leaders like ASE Technology Holding Co., Ltd.