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Broadcom Inc. Launches Groundbreaking 2nm 3.5D Face-to-Face Compute SoC

Last updated: February 26, 2026
Taurigo

PALO ALTO, CA – Broadcom Inc. (NASDAQ: AVGO), a leader in semiconductor and infrastructure software solutions, made headlines on February 26, 2026, with its announcement of the commencement of shipments for the industry’s first 2nm custom compute System-on-Chip (SoC) powered by its innovative 3.5D eXtreme Dimension System in Package (XDSiP) platform. This new technology is set to revolutionize the landscape of artificial intelligence (AI) and high-performance computing (HPC).

1. The 3.5D XDSiP Platform

The 3.5D XDSiP platform stands out by integrating advanced 2.5D techniques and 3D integrated circuit (IC) technology through its Face-to-Face (F2F) method. This sophisticated architecture allows for exceptional scalability and efficiency, enabling Broadcom's customers to meet the burgeoning computational needs of gigawatt-scale AI clusters.

Unmatched Performance for AI Applications

Broadcom’s XDSiP technology is designed to deliver next-generation XPUs (Accelerated Processing Units) that promise unparalleled signal density, superior power efficiency, and low latency. This advancement is crucial for organizations looking to harness the power of AI, as it allows compute, memory, and network I/O to scale independently within a compact form factor.

2. Strategic Partnership with Fujitsu

In a significant move, Broadcom has partnered with Fujitsu to deliver the first custom compute SoC utilizing the 3.5D XDSiP technology. Frank Ostojic, Senior Vice President and General Manager of Broadcom's ASIC Products Division, expressed pride in the collaboration, stating, “This is a testament to the outstanding execution and innovation by the Broadcom team.” He further highlighted that since the introduction of the 3.5D XDSiP platform in 2024, its capabilities have expanded to cater to a broader customer base, with additional shipments expected in the latter half of 2026.

Naoki Shinjo, Senior Vice President and Head of the Advanced Technology Development Unit at Fujitsu, praised the technology as a “transformative milestone in advanced semiconductor integration.” He emphasized that the combination of 2nm process innovation with F2F 3D integration unlocks remarkable compute density and energy efficiency, which are vital for the next era of AI and HPC. This advancement aligns with Fujitsu's FUJITSU-MONAKA initiative aimed at delivering high-performance, low-power processors.

3. Looking Ahead

The launch of Broadcom’s 3.5D XDSiP technology not only showcases the company’s leadership in semiconductor innovation but also positions it favorably in the rapidly evolving AI landscape. With the increasing demand for high-performance computing solutions, Broadcom’s latest SoC is expected to play a significant role in powering a more scalable and sustainable AI-driven society.

Broadcom's commitment to long-term R&D investment and its ability to execute at scale makes it a formidable player in the technology sector. As the company continues to expand its product offerings, stakeholders and industry watchers will be keenly observing how these advancements translate into market performance and competitive positioning.

For more information on Broadcom’s 3.5D XDSiP, further details can be found on their official website.

About Broadcom

Broadcom Inc. is a global technology leader that designs and supplies semiconductors and infrastructure software for complex, mission-critical needs. Headquartered in Palo Alto, California, Broadcom is dedicated to delivering cutting-edge technology solutions at scale, driven by extensive R&D investment and exceptional execution.

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